Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 16 items
Ideal for organic EL substrate cleaning! Alkaline-compatible spin cleaning device.
This device manually sets the workpiece onto the main body, performs vacuum suction, and conducts two-liquid cleaning, ultrasonic cleaning, and N2 blow drying while spinning.
Make effective use of limited space! It is a tabletop automatic spin cleaning machine.
This device is a tabletop automatic spin cleaner that manually sets the target workpiece and performs ultrasonic cleaning, pure water rinsing, and air blow drying through spin rotation.
Automatic spin cleaning device equipped with a clean unit.
Cassette-type automatic device equipped with a clean unit that allows you to select option contents (the photo shows scrubbing cleaning + UV cleaning + hot plate) =============================================== <Specifications> Work size…Φ2 inches to Φ8 inches Transport…Atmospheric 3-axis clean robot Clean unit…HEPA filter Cleaning…Brush, MS standard equipment Options…High-pressure jet nozzle, UV, excimer, hot plate, etc. Utilities…Power supply, compressed air, nitrogen, pure water, exhaust, waste liquid, others
Simple design manual spin cleaning device
Multipurpose Manual Device with Simple Design ==================================== <Specifications> Work Size... Φ2 inches to Φ6 inches Cleaning... Disk brush, standard equipment 1.1MS Options... High-pressure jet nozzle, chemical solution nozzle, etc. Power Supply... AC100v or 200v CDA... 0.5MPA or more Pure Water... 0.2MPA or more Others In a constant temperature water tank
Wafer Mask Sheet Spin Cleaning Device
It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.
Cleaning without the use of chemicals instead of RCA cleaning.
Our company offers a "Spin Cleaning Device" that does not require chemical solutions, eliminating the need for conventional wastewater treatment facilities of a general scale. Since there are no skin irritations such as chemical burns, the working environment is improved. Additionally, due to its high cleaning and rinsing capabilities, it is possible to reduce the amount of pure water used. 【Features】 ■ Reduction of wastewater treatment load ■ Improvement of the working environment ■ Reduction of pure water usage *For more details, please download the PDF or feel free to contact us.
One-chamber multipurpose scrub cleaning. It is possible to remove foreign substances and metal contamination in one chamber! Space-saving, making it suitable for research and development.
This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for locations with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one place ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.
This is a device that performs brush cleaning, ultrasonic cleaning, rinse cleaning, and N2 blow drying processes!
This is a space-saving, double-sided washable mechanism for a sheet-type spin cleaning device. It is easy to maintain and features high-speed spin drying and N2 drying, which reduces water marks. (Patent No. 3558543)
Full automatic spin cleaning device for 300mm/8-inch wafers, glass.
This device manually sets a wafer cassette into the main body, sends the stored target work to the spin cleaning section using a robot, and performs two-fluid cleaning, ultrasonic cleaning, and N2 blow drying while spinning, before storing it back in the wafer cassette.
The brush is cleaned with detergent (surfactants, etc.) by spinning rotation.
The "Compact Spin Cleaning Device ME-510" is a manual spinner that allows the operator to set the target workpiece manually. It performs brush cleaning with detergent (such as surfactants) through spin rotation, followed by pure water rinsing and air blow drying. The maximum rotation speed is 3000 rpm, and it accommodates sample sizes ranging from 30 to 150 mm, including PET film and glass. The brush section features brush elevation, rotation, and detergent supply, while the pure water supply section operates with a rotary air cylinder for pure water delivery. The main body dimensions are W650 x D800 x H710, and it has an aluminum frame. For more details, please contact us or refer to the catalog.
You can achieve high cleaning performance equivalent to that of higher-end models.
■ Ideal for "prototype development," "alternative to manual cleaning," "labor-saving," and "quality improvement," etc. ■ Unlike manual cleaning, it achieves a high level of surface quality without variation. ■ Achieves both improved base quality and reduced cleaning labor costs. ◎ For example, operating four tabletop cleaning machines with one worker at a low labor cost. ■ Optimal for processing Si, SiC, GaN, sapphire, GaAs, LT, etc. ■ Compatible with round substrates as well as square shapes like Cr masks. ◎ Max size: Φ20mm, 6 inches square. ■ The basic processing sequence is "detergent/scrub ⇒ DIW two-fluid ⇒ front and back rinse ⇒ spin dry." ◎ Scanning rotation function is standard during scrubbing and two-fluid processing. ◎ Excellent particle removal performance with the DIW two-fluid tool. ◎ Choose between nylon brush or PVA brush depending on the substrate surface condition. ■ Options available for <automatic detergent dilution unit> and <CO2 ionizer>. *For more details, please refer to the PDF document or feel free to contact us.*
Supports various sizes, board types, and device pattern conditions with the new in-house demo machine! Customizable to an optimal form.
This device is equipped with a variety of tools, including [horn-type ultrasonic], [BLT-type ultrasonic], [high-pressure jet nozzle], and [spray nozzle], to support demonstrations of organic lift-off for various substrate surface conditions. It can accommodate various sizes, substrate types, and device pattern states with an in-house demonstration machine. Furthermore, we will incorporate the insights and know-how gained to customize the implementation device into an optimal form. *For more details, please refer to the PDF materials or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, megasonic, cleaning equipment, photoresist, photolithography process, silicon, batch substrate cleaning machine, batch spin cleaning machine, surface treatment, thin wafer, insulating film, high-pressure jet cleaning machine, substrate cleaning equipment, load lock chamber, glass transport, glass substrate, wafer cleaning machine.
We respond to diverse cleaning needs with high-speed clean technology!
The "Spin Cleaning Device" is a product handled by Shimada Technology Co., Ltd. It adopts an environmentally friendly cleaning method centered on "water and air." It also achieves high-efficiency exhaust through a full-circle exhaust cup structure. Additionally, it realizes high yield with a variety of cleaning tools. Furthermore, we offer handling compatible with wafer-type and rectangular substrates, as well as a wide range of unit lineups that accommodate various sizes. 【Features】 ■ Contributes to energy savings through high performance ■ Achieves high yield with a variety of cleaning tools ■ Matches various sizes and substrates *For more details, please refer to the PDF document or feel free to contact us.
One-chamber multi-purpose scrub cleaning. It is possible to remove foreign substances and metal contamination in one chamber! Space-saving, making it suitable for research and development.
This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for areas with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can all be done in one place ■ Target wafers: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.
Complete various cleaning processes to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.
The "Chemical Liquid Scrub Spin Cleaning Device" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical liquids, as well as contact cleaning methods like brushes. It completes the cleaning process to spin drying within a single chamber, contributing to space-saving design that reduces installation space and costs. We can propose suitable device configurations based on various equipment configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemical liquids can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can also be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.
