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Spin Cleaner Product List and Ranking from 9 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

Spin Cleaner Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. ソフエンジニアリング Saitama//Industrial Electrical Equipment
  2. LC 洗浄装置事業部 Tokyo//Electronic Components and Semiconductors
  3. ダルトン Tokyo//Industrial Machinery
  4. 4 トービ Chiba//Electronic Components and Semiconductors
  5. 5 フクシマ 長野本社 Nagano//Manufacturing and processing contract
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Spin Cleaner Product ranking

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. Tabletop spin cleaning device ソフエンジニアリング
  2. Dual-sided brush spin cleaning device (post-CMP cleaning) *Test machine available ダルトン
  3. Single-leaf spin cleaning device LC 洗浄装置事業部
  4. 4 Semi-Automatic SPINDip Spin Coater Device - Lift-Off and Resist Stripping ソフエンジニアリング
  5. 4 Leaf-type spin cleaning device LC 洗浄装置事業部

Spin Cleaner Product List

1～13 item / All 13 items

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Automatic spin cleaning device

Automatic spin cleaning device

Automatic spin cleaning device equipped with a clean unit.

Cassette-type automatic device equipped with a clean unit that allows you to select option contents (the photo shows scrubbing cleaning + UV cleaning + hot plate) =============================================== <Specifications> Work size…Φ2 inches to Φ8 inches Transport…Atmospheric 3-axis clean robot Clean unit…HEPA filter Cleaning…Brush, MS standard equipment Options…High-pressure jet nozzle, UV, excimer, hot plate, etc. Utilities…Power supply, compressed air, nitrogen, pure water, exhaust, waste liquid, others

  • Other semiconductor manufacturing equipment
  • Spin Cleaner

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Manual spin cleaning device

Manual spin cleaning device

Simple design manual spin cleaning device

Multipurpose Manual Device with Simple Design ==================================== <Specifications> Work Size... Φ2 inches to Φ6 inches Cleaning... Disk brush, standard equipment 1.1MS Options... High-pressure jet nozzle, chemical solution nozzle, etc. Power Supply... AC100v or 200v CDA... 0.5MPA or more Pure Water... 0.2MPA or more Others In a constant temperature water tank

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Wafer Mask Sheet Spin Cleaning Device

Wafer Mask Sheet Spin Cleaning Device

Wafer Mask Sheet Spin Cleaning Device

It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.

  • Other semiconductor manufacturing equipment
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Spin cleaning device

Spin cleaning device

Cleaning without the use of chemicals instead of RCA cleaning.

Our company offers a "Spin Cleaning Device" that does not require chemical solutions, eliminating the need for conventional wastewater treatment facilities of a general scale. Since there are no skin irritations such as chemical burns, the working environment is improved. Additionally, due to its high cleaning and rinsing capabilities, it is possible to reduce the amount of pure water used. 【Features】 ■ Reduction of wastewater treatment load ■ Improvement of the working environment ■ Reduction of pure water usage *For more details, please download the PDF or feel free to contact us.

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Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"

Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"

One-chamber multipurpose scrub cleaning. It is possible to remove foreign substances and metal contamination in one chamber! Space-saving, making it suitable for research and development.

This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for locations with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one place ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

  • Other semiconductor manufacturing equipment
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Dual-sided brush spin cleaning device (post-CMP cleaning) *Test machine available

Dual-sided brush spin cleaning device (post-CMP cleaning) *Test machine available

It is a device that cleans the surface and back of the wafer with a brush at the same time.

By combining with two-fluid cleaning, it is possible to remove strong adherents and fine particles. It is mainly used for cleaning after CMP. Example of equipment configuration: Loader ⇒ 1. Brush cleaning chamber ⇒ 2. Rinse drying chamber ⇒ Unloader 1. Brush cleaning chamber ⇒ Chemical shower → Double-sided brush cleaning → Pure water rinse 2. Rinse drying chamber ⇒ Two-fluid (N2 + pure) cleaning → MS shower (optional) → N2 blow drying

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Tabletop spin cleaning device

Tabletop spin cleaning device

You can achieve high cleaning performance equivalent to that of higher-end models.

■ Ideal for "prototype development," "alternative to manual cleaning," "labor-saving," and "quality improvement," etc. ■ Unlike manual cleaning, it achieves a high level of surface quality without variation. ■ Achieves both improved base quality and reduced cleaning labor costs. 　◎ For example, operating four tabletop cleaning machines with one worker at a low labor cost. ■ Optimal for processing Si, SiC, GaN, sapphire, GaAs, LT, etc. ■ Compatible with round substrates as well as square shapes like Cr masks. 　◎ Max size: Φ20mm, 6 inches square. ■ The basic processing sequence is "detergent/scrub ⇒ DIW two-fluid ⇒ front and back rinse ⇒ spin dry." 　◎ Scanning rotation function is standard during scrubbing and two-fluid processing. 　◎ Excellent particle removal performance with the DIW two-fluid tool. 　◎ Choose between nylon brush or PVA brush depending on the substrate surface condition. ■ Options available for <automatic detergent dilution unit> and <CO2 ionizer>. *For more details, please refer to the PDF document or feel free to contact us.*

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Semi-Automatic SPINDip Spin Coater Device - Lift-Off and Resist Stripping

Semi-Automatic SPINDip Spin Coater Device - Lift-Off and Resist Stripping

Supports various sizes, board types, and device pattern conditions with the new in-house demo machine! Customizable to an optimal form.

This device is equipped with a variety of tools, including [horn-type ultrasonic], [BLT-type ultrasonic], [high-pressure jet nozzle], and [spray nozzle], to support demonstrations of organic lift-off for various substrate surface conditions. It can accommodate various sizes, substrate types, and device pattern states with an in-house demonstration machine. Furthermore, we will incorporate the insights and know-how gained to customize the implementation device into an optimal form. *For more details, please refer to the PDF materials or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, megasonic, cleaning equipment, photoresist, photolithography process, silicon, batch substrate cleaning machine, batch spin cleaning machine, surface treatment, thin wafer, insulating film, high-pressure jet cleaning machine, substrate cleaning equipment, load lock chamber, glass transport, glass substrate, wafer cleaning machine.

  • Other processing machines
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Spin cleaning device

Spin cleaning device

We respond to diverse cleaning needs with high-speed clean technology!

The "Spin Cleaning Device" is a product handled by Shimada Technology Co., Ltd. It adopts an environmentally friendly cleaning method centered on "water and air." It also achieves high-efficiency exhaust through a full-circle exhaust cup structure. Additionally, it realizes high yield with a variety of cleaning tools. Furthermore, we offer handling compatible with wafer-type and rectangular substrates, as well as a wide range of unit lineups that accommodate various sizes. 【Features】 ■ Contributes to energy savings through high performance ■ Achieves high yield with a variety of cleaning tools ■ Matches various sizes and substrates *For more details, please refer to the PDF document or feel free to contact us.

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Single-leaf spin cleaning device

Single-leaf spin cleaning device

Accommodating various process needs with a diverse range of chamber forms! Work sizes range from 2-inch to 12-inch wafers.

The "Sheet-type Spin Cleaning Device" can be equipped with ultrasonic spray nozzles, two-fluid spray nozzles, high-pressure jet nozzles, ozone water, and more, allowing for processing tailored to specific applications. It accommodates work sizes from 2-inch to 12-inch wafers. It can also handle square substrates up to 500mm on a side (consultation required). The device can be configured with process modules for acidic, alkaline, and organic solutions. 【Features】 ■ Versatile chamber configurations to meet various process needs ■ Compatible with work sizes from 2-inch to 12-inch wafers ■ Can also accommodate square substrates up to 500mm on a side (consultation required) ■ Configurable with process modules for acidic, alkaline, and organic solutions *For more details, please download the PDF or feel free to contact us.

  • Other surface treatment equipment
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Leaf-type spin cleaning device

Leaf-type spin cleaning device

A sheet multi-spin processor that accommodates complex process needs with multiple chamber configurations!

We would like to introduce the "Sheet-type Spin Cleaning Device" that we handle. The work size ranges from Φ2" to 12" wafers or square substrates (up to a maximum of 600mm□). No setup changes are required for size adjustments. In the automatic type, when the cassette is set in the loader, the clean robot transports the workpiece and automatically performs chemical treatment, rinsing, and spin drying. In the manual type, the workpiece can be manually set in the chuck, and the same processes can be carried out. 【Specifications (partial)】 ■ Work materials - Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, SUS plates, etc. ■ Chemical tanks: Chemical supply tanks and waste liquid tanks can be built into both sides of the main unit. ■ PVA disk brush can be installed. *For more details, please download the PDF or feel free to contact us.

  • 枚葉式スピン洗浄装置2.png
  • 枚葉式スピン洗浄装置3.png
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Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"

Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"

One-chamber multi-purpose scrub cleaning. It is possible to remove foreign substances and metal contamination in one chamber! Space-saving, making it suitable for research and development.

This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for areas with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can all be done in one place ■ Target wafers: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

  • Other semiconductor manufacturing equipment
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  • Ultrasonic Cleaner
  • Spin Cleaner

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Chemical liquid scrub spin cleaning device

Chemical liquid scrub spin cleaning device

Complete various cleaning processes to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.

The "Chemical Liquid Scrub Spin Cleaning Device" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical liquids, as well as contact cleaning methods like brushes. It completes the cleaning process to spin drying within a single chamber, contributing to space-saving design that reduces installation space and costs. We can propose suitable device configurations based on various equipment configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemical liquids can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can also be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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